Beschreibung

An comprehensive guide to advanced MEMS packaging methodsThis book presents the latest and cutting-edge MEMS (Microelectromechanical systems) packaging techniques such as low-temperature bonding and 3D packaging. Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenging problems created by the ever-increasing interests in MEMS devices and packaging. This authoritative guide is ideal for anyone who needs to choose a reliable, creative, high-performance, robust, and cost-effective packaging technique for MEMS devices. The book will also aid in stimulating further research and development in optical, electrical, and thermal designs as well as materials, process, manufacturing, testing, and reliability.

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